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Untersuchungen zur Integration von MOCVD-Titannitridbarriere- und Kupferschichten in Leitbahnsysteme der Mikroelektronik

By Stephan Riedel

Untersuchungen zur Integration von MOCVD-Titannitridbarriere- und Kupferschichten in Leitbahnsysteme der Mikroelektronik Business & Technology

Untersuchungen zur Integration von MOCVD-Titannitridbarriere- und Kupferschichten in Leitbahnsysteme der Mikroelektronik

By Stephan Riedel

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Product details

Binding:: Paperback
Number of Pages:: 172
Publication Date:: 2002-05-17
Publisher:: Shaker Verlag GmbH
ISBN10:: 3832201866
Weight:: 258 g

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Almost no signs of wear. Book pages have no markings, accessories are intact and all other media are in good condition.

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