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Recent Trends in VLSI and Semiconductor Packaging

Recent Trends in VLSI and Semiconductor Packaging

- Default Title
Description
The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.
Product details
Binding:
Paperback
Edition:
1
Number of Pages:
652
Release Date:
2025-05-06
Publication Date:
2025-05-06
Publisher:
CRC Press
Languages:
Original: English
ISBN10:
1041017871
ISBN13:
9781041017875
Weight:
1568 g
Height:
210 cm
Width:
280 cm
Thickness:
35 cm
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