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Recent Trends in VLSI and Semiconductor Packaging
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Description
Product details
Binding:
Paperback
Edition:
1
Number of Pages:
652
Release Date:
2025-05-06
Publication Date:
2025-05-06
Publisher:
CRC Press
Languages:
Original:
English
ISBN10:
1041017871
ISBN13:
9781041017875
Weight:
1568 g
Height:
210 cm
Width:
280 cm
Thickness:
35 cm
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