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Handbook of Wafer Bonding

Product Image: Handbook of Wafer Bonding

Handbook of Wafer Bonding

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Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Product details
Edition:
1
Number of Pages:
428
Release Date:
2012-01-11
Publication Date:
2012-02-06
Publisher:
John Wiley & Sons
Languages:
Original: English
ISBN10:
3527326464
ISBN13:
9783527326464
GPSR Manufacturer Reference:
[email protected]
Weight:
916 g
Height:
175 cm
Width:
250 cm
Thickness:
27 cm
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