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Guidebook for Managing Silicon Chip Reliability

Guidebook for Managing Silicon Chip Reliability Business & Technology

Guidebook for Managing Silicon Chip Reliability

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Description
This is an excellent text detailing situations the professional will encounter in practice. The book: * Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging. * Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk * Outlines how to establish the specifications defining chip performance, cost, quality, and reliability. * Concentrates on device failure and causes throughout the text - showing how to model the mechanism, test for defects, and avoid and manage damange. * Presents information on evolving IC technologies. TOC:Introduction.- How Devices Fail.- Intrinsic Device Sensitivities.- Electromigration.- Hot Carrier Aging.- Time Dependent Dielectric Breakdown. Mechanical Stress Induced Migration.- Alpha Particle Sensitivity.- Electrostatic Discharge and Electrical Overstress. Latch-Up. Qualification. Screening. Design for Reliability. Summary.
Product details
Edition:
1
Number of Pages:
226
Release Date:
1998-12-01
Publication Date:
1998-12-29
Publisher:
CRC Press
Languages:
Original: English
ISBN10:
0849396247
ISBN13:
9780849396243
Weight:
508 g
Height:
161 cm
Width:
240 cm
Thickness:
17 cm
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