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ENCYCLO THERMAL PACK SET 2 (V1)

By Iyengar Madhusudan

ENCYCLO THERMAL PACK SET 2 (V1)

By Iyengar Madhusudan

0 - Default Title
Description
The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions.
The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Product details
Number of Pages:
434
Release Date:
2014-12-18
Publication Date:
2014-11-03
Publisher:
World Scientific
Languages:
Original: English
ISBN10:
9814327638
ISBN13:
9789814327633
Weight:
924 g
Height:
175 cm
Width:
250 cm
Thickness:
28 cm
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