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Tribology In Chemical-Mechanical Planarization

By Hong Liang

Tribology In Chemical-Mechanical Planarization Business & Technology

Tribology In Chemical-Mechanical Planarization

0 - Default Title
Description
Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Product details
Binding:
Paperback
Edition:
1
Number of Pages:
200
Release Date:
2019-09-27
Publication Date:
2019-09-19
Publisher:
CRC Press
Languages:
Original: English
ISBN10:
0367393255
ISBN13:
9780367393250
GPSR Manufacturer Reference:
[email protected]
Weight:
313 g
Height:
156 cm
Width:
234 cm
Thickness:
11 cm
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