Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics, 30, Band 30)

Name: Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics, 30, Band 30)
Brand: Springer
Availability: OutOfStock
Rating: 5 (1 reviews)

By Tong, Xingcun Colin

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Product details

Edition:

1

Number of Pages:

640

Release Date:

2011-01-10

Publication Date:

2011-01-10

Publisher:

Springer

Languages:

Published: English, Original: English

ISBN10:

1441977589

GPSR Manufacturer Reference:

[email protected]

Weight:

1021 g

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