Placeholder text

Go to cart

3D Integration for VLSI Systems

By Tan, Chuan Seng

3D Integration for VLSI Systems Computer Science

3D Integration for VLSI Systems

0 - Used - good
Description
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.
There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
Product details
Edition:
1
Number of Pages:
378
Release Date:
2011-09-26
Publication Date:
2011-09-26
Publisher:
Jenny Stanford Publishing
Languages:
Original: English
ISBN10:
981430381X
ISBN13:
9789814303811
GPSR Manufacturer Reference:
[email protected]
Weight:
697 g
Height:
157 cm
Width:
235 cm
Thickness:
25 cm
Buy on Amazon
Currently sold out