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Electronic Materials Innovations and Reliability in Advanced Memory Packaging

By Gan, Chong Leong

Electronic Materials Innovations and Reliability in Advanced Memory Packaging

By Gan, Chong Leong

- Default Title
Description
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Product details
Number of Pages:
196
Release Date:
2025-07-22
Publication Date:
2025-07-22
Publisher:
Springer Nature Switzerland
Languages:
Original: English
ISBN10:
3031947940
ISBN13:
9783031947940
GPSR Manufacturer Reference:
[email protected]
Weight:
463 g
Height:
160 cm
Width:
241 cm
Thickness:
17 cm
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