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Through Silicon Vias

By Kaushik, Brajesh Kumar

Through Silicon Vias

By Kaushik, Brajesh Kumar

0 - Default Title
Description
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
Product details
Binding:
Paperback
Edition:
1
Number of Pages:
232
Release Date:
2020-06-30
Publication Date:
2020-06-30
Publisher:
CRC Press
Languages:
Original: English
ISBN10:
0367574543
ISBN13:
9780367574543
GPSR Manufacturer Reference:
[email protected]
Weight:
360 g
Height:
156 cm
Width:
234 cm
Thickness:
13 cm
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