Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75, Band 75)

Name: Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75, Band 75)
Brand: Springer
Availability: OutOfStock
Rating: 5 (1 reviews)

By Marin Alexe

0 - Default Title

Product details

Edition:

1

Number of Pages:

519

Release Date:

2004-05-14

Publication Date:

2004-05-14

Publisher:

Springer

Languages:

Published: English, Original: English

ISBN10:

3540210490

GPSR Manufacturer Reference:

[email protected]

Weight:

862 g

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