{"product_id":"peter-ramm-handbook-of-wafer-bonding-9783527326464","title":"Handbook of Wafer Bonding","description":"The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.\n\u003cbr\u003e\nPart I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal\/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.\n\u003cbr\u003e\nThis book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.","brand":"John Wiley \u0026 Sons","offers":[{"title":"Default Title","offer_id":53631582765398,"sku":null,"price":0.0,"currency_code":"EUR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0925\/5829\/5382\/files\/product_image_9783527326464_1.jpg?v=1778660230","url":"https:\/\/www.momoxbooks.com\/products\/peter-ramm-handbook-of-wafer-bonding-9783527326464","provider":"momoxbooks","version":"1.0","type":"link"}