{"product_id":"harjinder-singh-analyse-du-vide-induit-par-la-contrainte-et-de-l-electromigration-des-liaisons-cu-cu-9786205599891","title":"Analyse du vide induit par la contrainte et de l'électromigration des liaisons Cu-Cu","description":null,"brand":"Editions Notre Savoir","offers":[{"title":"Default Title","offer_id":53867104272726,"sku":null,"price":0.0,"currency_code":"EUR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0925\/5829\/5382\/files\/product_image_9786205599891_1.jpg?v=1781853166","url":"https:\/\/www.momoxbooks.com\/products\/harjinder-singh-analyse-du-vide-induit-par-la-contrainte-et-de-l-electromigration-des-liaisons-cu-cu-9786205599891","provider":"momoxbooks","version":"1.0","type":"link"}