{"product_id":"christian-schmidt-verkapselungstechnologie-mit-justiertem-adhaesiven-waferbonden-fuer-oled-auf-cmos-anwendungen-9783942710848","title":"Verkapselungstechnologie mit justiertem adhäsiven Waferbonden für OLED-auf-CMOS-Anwendungen","description":null,"brand":"TUDpress","offers":[{"title":"Default Title","offer_id":53748007960918,"sku":null,"price":0.0,"currency_code":"EUR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0925\/5829\/5382\/files\/product_image_9783942710848_1.jpg?v=1781790182","url":"https:\/\/www.momoxbooks.com\/products\/christian-schmidt-verkapselungstechnologie-mit-justiertem-adhaesiven-waferbonden-fuer-oled-auf-cmos-anwendungen-9783942710848","provider":"momoxbooks","version":"1.0","type":"link"}