{"product_id":"brajesh-kaushik-kumar-through-silicon-vias-9780367574543","title":"Through Silicon Vias","description":"Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph","brand":"CRC Press","offers":[{"title":"Default Title","offer_id":53728940654934,"sku":null,"price":0.0,"currency_code":"EUR","in_stock":false}],"url":"https:\/\/www.momoxbooks.com\/products\/brajesh-kaushik-kumar-through-silicon-vias-9780367574543","provider":"momoxbooks","version":"1.0","type":"link"}