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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
By Beth Keser
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
By Beth Keser
0 - Default Title
Product details
Edition:
1
Number of Pages:
320
Release Date:
2021-12-29
Publication Date:
2021-12-07
Publisher:
Wiley-IEEE Press
Languages:
Published:
English,
Original:
English
ISBN10:
1119793777
GPSR Manufacturer Reference:
Weight:
567 g
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